Fast heat up, 10 seconds to reach 250°C.
• Built in temperature sensor for stable temperature control.
• Hot and cool air selection for chip preheating or cooling.
• Used together with a hot air rework station and fixture for BGA and other IC's.
• Power: 460W.
• Temperature: 120°C to 250°C(at nozzle).
• Air volume: 0.18 cubic meter/min.
• Size: 100(W) x60 (H) x170 (D) mm.
• Weight: 1kg.